发明名称 Chip type electronic component for test, and mounted state test method
摘要 A chip type electronic component for test is provided with an element body, and four or more terminal electrodes placed on the exterior of the element body. The element body has a plurality of laminated insulator layers, and a plurality of internal electrodes arranged to be opposed to each other with the insulator layer in between. Each of the internal electrodes is connected to at least one same terminal electrode out of the four or more terminal electrodes and connected to any one terminal electrode except for the at least one same terminal electrode.
申请公布号 US2007242405(A1) 申请公布日期 2007.10.18
申请号 US20070783240 申请日期 2007.04.06
申请人 TDK CORPORATION 发明人 AHIKO TAISUKE;MASUDA SUNAO;TOGASHI MASAAKI;CHIBA TAKASHI
分类号 H02H9/06 主分类号 H02H9/06
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