BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION
摘要
Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing comprises a conductive material. In another embodiment, the housing comprises a lower housing and a contact cover wherein the contact cover comprises a conductive material.
申请公布号
WO2007117301(A2)
申请公布日期
2007.10.18
申请号
WO2006US60421
申请日期
2006.11.01
申请人
APPLIED MATERIALS, INC.;MANENS, ANTOINE P.;DUBOUST, ALAIN;OLGADO, DONALD J.K.;WANG, YAN;SALAS-VERNIS, JOSE;CHANG, SHOU-SUNG
发明人
MANENS, ANTOINE P.;DUBOUST, ALAIN;OLGADO, DONALD J.K.;WANG, YAN;SALAS-VERNIS, JOSE;CHANG, SHOU-SUNG