| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounted coil adapted extremely as a coil which is automatically disposed on a substrate by an automatic mounting apparatus such as a chip mounter for example and connected to a wiring circuit of the substrate by reflow soldering and mounted on the substrate. SOLUTION: The surface mounted coil can be mounted on a substrate 1 by providing conductive metal plates 5 at opposite ends of a core 2 wound by a conductor wire 3, connecting opposite ends of the conductor wire 3 wound on the core 2 with the metal plates 5 at the opposite ends of the core 2 respectively, and connecting the mounting electrode plates 5 with circuit wiring of the substrate 1 taking the metal plates 5 as the mounting electrode plates 5. COPYRIGHT: (C)2008,JPO&INPIT
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