| 发明名称 |
Production of a solder used in the production of electronic and/or optoelectronic components comprises applying layers containing gold and tin to a wetting metal and heating so that the gold and tin layers react to form an alloy |
| 摘要 |
<p>Production of a solder comprises applying layers containing gold and tin to a wetting metal and heating so that the gold and tin layers react to form an alloy. An independent claim is also included for a solder containing an alloy of gold and tin.</p> |
| 申请公布号 |
DE102006053146(A1) |
申请公布日期 |
2007.10.18 |
| 申请号 |
DE20061053146 |
申请日期 |
2006.11.10 |
| 申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. |
发明人 |
OPPERMANN, HERMANN |
| 分类号 |
B23K1/19 |
主分类号 |
B23K1/19 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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