| 摘要 |
<p>The invention relates to a method of producing an adhesive bond between a first and a second substrate (2, 4), comprising: a) a step of preparing the surfaces (6, 8) to be assembled, b) the assembling of these two surfaces, by direct molecular bonding, c) a step of heat treatment, including a temperature hold in the range 50°C - 100°C for at least one hour.</p> |
| 申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE;BENEYTON, REMI;MORICEAU, HUBERT;FOURNEL, FRANK;RIEUTORD, FRANCOIS;LE TIEC, YANNICK |
发明人 |
BENEYTON, REMI;MORICEAU, HUBERT;FOURNEL, FRANK;RIEUTORD, FRANCOIS;LE TIEC, YANNICK |
