| 摘要 |
PROBLEM TO BE SOLVED: To provide resin sealing technique hardly generating electric short circuit caused by metallic foreign matter mixed into sealing resin. SOLUTION: The metallic mold is provided with a pot for receiving resin, a cavity for receiving a semiconductor chip which should be sealed through resin sealing, and the way of resin or a runner for guiding the resin received in the pot to the cavity. A foreign matter pile-up unit consisting of a recess formed by digging a part of the inner surface of the runner further is formed. A magnet for the runner attracts the metallic foreign matter comprised in fluid transported through the inside of the runner to the inner surface of the foreign matter pile-up unit. COPYRIGHT: (C)2008,JPO&INPIT
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