| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a camera module whose hermetic property is not hurt between a frame and a wiring board by a stress during cutting. SOLUTION: The method includes, at least, a solid imaging element loading step in which a solid imaging device is mounted corresponding to the wiring board on an assembly board formed with a plurality of wiring boards in a shape of a matrix; a frame loading step in which a frame is loaded and fixed by overlaying the solid imaging device on the wiring board of the assembly board; a partitioning step separating into each camera module by cutting according to a cut-off line established in accordance with the wiring board, before performing the partition step; a step which applies a stiffening component to a position which adjoins the cut-off line, and surrounds the fixing part of the frame and the wiring board for reinforcing the above fixing part. COPYRIGHT: (C)2008,JPO&INPIT
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