| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device capable of uniformly imparting a pressure to the entire surface for each IC chip and normally connecting each IC chip and the terminal electrode of a wiring board when closely mounting two IC chips on the terminal electrode of the wiring board. SOLUTION: A guide member 10 is formed on a head attaching base 7, a press bonding head 14 is disposed to a mover 11 movable along the guide member 10, and the press bonding head 14 is fixed at the optional position of the head attaching base 7 through the mover 11. COPYRIGHT: (C)2008,JPO&INPIT
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