| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure and a connection method of circuit substrates which enable effective and sure connection of circuit substrates with high strength. SOLUTION: A first circuit substrate 10 is provided with a first connection pattern 13, and a second circuit substrate 40 is provided with a second connection pattern 43. A case 90 is integrally formed of a molding resin around a junction T which joins the first connection pattern 13 of the first circuit substrate 10 and the second connection pattern 43 of the second circuit substrate 40. The first circuit substrate 10 is flexible, the second circuit substrate 40 is flexible, and a reinforcing plate 60 is laminated in a surface opposite to a surface provided with the first connection pattern 13 of the first circuit substrate 10 inside the case 90. COPYRIGHT: (C)2008,JPO&INPIT
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