| 摘要 |
PROBLEM TO BE SOLVED: To prevent a variation in the shape and thickness of a resin sealing layer and improve the adhesive strength of a part chip to a wiring board and the protection of the part chip from undesired external action. SOLUTION: The electronic component mounting circuit board is provided with a circuit wiring board 1 having a plurality of circuit wiring layers S1, L1 and L2 formed on an insulating board 2, a facing panel 3 which is provided facing and away from the circuit wiring board, a plurality of electronic components 20 which are connected to the circuit wiring layer by means of conductive adhesive layers 21 and 22 and mounted between the wiring board 1 and mounted between the wiring board 1 and the facing panel 3, and a resin sealing layer 23 which is formed by covering the surface of the electronic part 20 and the conductive adhesive layers 21 and 22 and molding them by injection. COPYRIGHT: (C)2008,JPO&INPIT
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