| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste composition with which a coating film having a sufficient thickness can be formed with a single time of coating work; and to form a bump having a sufficient height even by the number of times of application smaller than that of a conventional one. SOLUTION: This conductive paste composition contains a phenolic resin, a melamine resin, conductive powder, a solvent, and a bump formation aid formed of a monohydric alcohol having a methoxy group at an end and having at least one ether bond. This printed wiring board uses the conductive paste composition. COPYRIGHT: (C)2008,JPO&INPIT
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