Miniaturisiertes Multi-Chip Modul und Verfahren zur Herstellung desselben

摘要

The multi-chip module has integrated circuit chips (40) mounted on surface of substrate. An interposer (60) having thickness more than largest height of chip, has substrate confronting surface and board confronting surface. The substrate confronting surface is mounted on substrate such that conductors are connected electrically and respectively to solder pads (31) on substrate and chip receiving space is formed. A board confronting surface is mounted on circuit board such that conductors are connected electrically to the circuit board. An independent claim is included for method for manufacturing miniaturized multi-chip module.