ELECTRONIC COMPONENTS EMBEDDED PCB AND THE METHOD FOR MANUFACTURING THEREOF

摘要

An electronic component embedded PCB and a method for manufacturing the same are provided to improve productivity by minimizing the use of a different sort of material due to a symmetric structure of the PCB. An electronic component embedded PCB includes a core substrate(10), a through hole(12), an electronic component(20), a first insulation layer(30), a second insulation layer(32), and a circuit pattern(34). The through hole(12) is punctured on the substrate(10). The electronic component(20) is embedded in the through hole(12), and has a thickness corresponding to the thickness of the core substrate(10). The first insulation layer(30) is stacked on a plane of the core substrate(10). The second insulation layer(32) is stacked on the other plane of the core substrate(10), and has the thickness corresponding to the thickness of the first insulation layer(30). The circuit pattern(34) is formed on a surface of the first insulation layer(30) and the second insulation layer(32).