SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing method and a substrate processing apparatus are provided to remove efficiently particles from a surface of a substrate without the damage of the substrate by lessening the adhesiveness between the particles and the substrate surface using a freezing process on a liquid layer. A liquid layer is attached to a surface of a substrate. A freezing process is performed on the liquid layer by using a freezing unit(2). The frozen liquid layer is removed from the substrate surface by performing a cleaning process on the substrate using a cleaning unit(1). At this time, unwanted particles are removed from the substrate surface. The cleaning process is one selected from a group consisting of a physical cleaning process, a chemical cleaning process or a combinational cleaning process of the physical and chemical cleaning processes.