发明名称 Circuit element having a first layer of an electrically insulating substrate material and method for manufacturing a circuit element
摘要 Circuit element having a first layer composed of an electrically insulating substrate material, a first electrically conductive material which is in the form of at least one discrete area, such that it is embedded in or applied to the substrate material, a second layer having a second electrically conductive material, and a monomolecular layer, which is composed of electrically active molecules which transports charge carriers, arranged between the first layer and the second layer. The monomolecular layer is immobilized and makes electrical contact with the second layer. Each of the electrically active molecules has a first unit, which is used as an electron donor, a second unit, which is used as an electron acceptor, wherein the electron donor and the electron acceptor form a diode, and at least one redox-active unit, by means of which a variable resistance is formed, arranged between the first unit and the second unit.
申请公布号 US7283372(B2) 申请公布日期 2007.10.16
申请号 US20040857635 申请日期 2004.05.28
申请人 INFINEON TECHNOLOGIES AG 发明人 WEBER WERNER;SCHMID GUNTER;LUYKEN RICHARD J.;THEWES ROLAND;SEITZ MARKUS
分类号 H05K7/02;G11C13/02;H01L27/28;H01L51/00;H01L51/30;H05K7/06;H05K7/08;H05K7/10 主分类号 H05K7/02
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