| 摘要 |
A method of making an exposed-pad ball-grid array package ( 11 ) includes applying a conductive sheet ( 16 ) to an adhesive tape ( 18 ). Stamping the conductive sheet ( 16 ) to form a die pad ( 24 ) and separating the remainder ( 26 ) of the sheet from the adhesive tape ( 18 ) so that only the die pad ( 24 ) remains on the adhesive tape ( 18 ). A substrate ( 28 ) is applied to the adhesive tape ( 18 ) proximate to the die pad ( 24 ). A die ( 30 ) is attached to the die pad ( 24 ) and electrically coupled to the substrate ( 28 ). An encapsulant ( 34 ) is formed around at least a portion of the die ( 30 ), the die pad ( 24 ) and the substrate ( 28 ) above the adhesive tape ( 18 ). The adhesive tape ( 18 ) is removed from the die pad ( 24 ), substrate ( 28 ) and encapsulant ( 34 ). Conductive balls ( 36 ) are attached to the substrate ( 28 ).
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