发明名称 |
Component mounting method |
摘要 |
In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.
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申请公布号 |
US7281322(B2) |
申请公布日期 |
2007.10.16 |
申请号 |
US20060426735 |
申请日期 |
2006.06.27 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ONOBORI SHUNJI;MINAMITANI SHOZO;HIRATA SHUICHI;NAKANISHI TOMOAKI |
分类号 |
H05K3/30 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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