| 摘要 |
The connection resistance between a metal bump (8) and a metal layer (10) for forming a wiring film deposited later is further decreased, the connection stability is enhanced, the wiring path passing through the metal bump (8) is further shortened, the planarity is enhanced, and the metal bump (8) does not come out easily. A wiring film interconnecting member wherein a plurality of pillar-like metal bumps (8) composed of copper and having a cross-sectional area of the top surface smaller than that of the bottom surface and interconnecting the wiring films of a multilayer wiring board are buried in an interlayer insulation film (10) in such a way that at least one end projects. The upper surface of the interlayer insulation film (10) is so curved as to be high at a part in contact with the metal bump (8) and lower gradually as being farther therefrom. |
