| 摘要 |
The present invention provides a positive photosensitive resin composition of high sensitivity which can form a pattern of high resolution and high residual film ratio and which can give a cured film superior in mechanical properties, adhesivity and water absorptivity. That is, the present invention lies in a positive photosensitive resin composition comprising 100 parts by weight of an alkali-soluble resin, 1 to 100 parts by weight of a photosensitive diazoquinone compound (B) and a filler (C), characterized in that content F of the filler (C) represented by the following formula is 2 to 70% by weight: <DF>F = filler (C) / Äalkali-soluble resin + filler (C)Ü </DF> <IMAGE> |
