MICRO ACOUSTIC SENSING APPARATUS AND MANUFACTURING THEREOF

摘要

A micro acoustic sensing apparatus and a manufacturing method thereof are provided to reduce the size of a die even with an anisotropic wet-type etching process since the shape of a vibration plate does not depend on the etching shape of a silicon substrate. A micro acoustic sensing apparatus includes a substrate unit(500), a backplate unit(510), and a vibration plate unit(520). The substrate unit(500) has a hole at the center thereof. The backplate unit(510) is formed on the substrate unit(500), is composed of an insulation film and a first conductive thin film, and has a plurality of holes at a place corresponding to the center of the substrate unit(500). The circumferential part of the vibration plate unit(520) is contacted to the insulation film of the backplate unit(510), and the central part thereof is separated from the center of the backplate unit(510) by a predetermined distance. The vibration plate unit(520) is composed of a second conductive thin film.