SEMICONDUCTOR DEVICE PACKAGE

摘要

A semiconductor device package is provided to prevent swelling phenomenon between a semiconductor chip and a printed circuit board by forming a groove for escaping a void in a process for adhering a semiconductor chip on the printed circuit board. Bonding pads(112) are formed on a semiconductor chip(110), and a printed circuit board(120) has a dielectric pattern(122) with a groove for exposing a portion of a lower edge of the semiconductor chip, and bonding electrodes(124) corresponding to the bonding pads. An adhesive material(114) adheres a lower portion of the semiconductor chip and the dielectric pattern to mount the semiconductor chip on the printed circuit board. Bonding wires(140) electrically connect the bonding electrodes with the corresponding bonding pads.