| 摘要 |
<p>A substrate transfer method, a substrate processing method and apparatus are provided to perform stably a transfer process of a substrate treated at a high temperature by using a plate capable of loading the substrate. A chuck(21) is used for supplying a high temperature. A plate(23) is separated from the chuck, wherein the plate is used for loading stably a substrate(27) performed with a high temperature treatment. The plate is unloaded from a chamber(10). The high temperature supplied from the chuck is in a range of 400 °C or more. The plate is separated from the chuck by descending the chuck while supporting an edge portion of the plate. The plate is unloaded from the chamber by using a transfer member.</p> |
