SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor device manufacturing method that enable to reduce the number of manufacturing steps by collectively executing steps related to heat hardening of a resin when manufacturing the semiconductor device.

SOLUTION: The semiconductor device has a semiconductor element 28 mounted on a laminated substrate. The laminated substrate 20 includes a plurality of circuit forming layers 24 joined by a first resin material 26. The semiconductor element 28 is joined to the laminated substrate 20 by a second resin material 30. The first/second resin materials 26, 30 are made of a resin that hardens under the same heating conditions.

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