| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipating structure, in which a plurality of memory devices are cooled efficiently and which is facilitated in the attachment and detachment of the memory device, and an information processor. SOLUTION: The heat dissipating structure 100 is equipped with a first supporting body 30 with a first memory device 12 mounted thereon detachably, a second supporting body 30 with a second memory device 12 mounted thereon detachably, a heat receiving unit 41 arranged between the first memory device 12 and the second memory device 12, a guide mechanism 20 and a fixing mechanism 200. The guide mechanism 20 supports the first supporting body 30, the second supporting body 30 and the heat receiving unit 41 so that the relative position of the heat receiving unit 41 and the first supporting body 30 can be changed along a straight line S1 and the relative position of the heat receiving unit 41 and the second supporting body 30 can be changed along the straight line S1. The fixing mechanism 200 fixes the first supporting body 30, the second supporting body 30 and the heat receiving unit 41 mutually so that the first memory device 12 is closely contacted with the heat receiving unit 41 and the second memory device 12 is closely contacted with the heat receiving unit 41. COPYRIGHT: (C)2008,JPO&INPIT
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