发明名称 LAMINATED CERAMIC ELECTRONIC COMPONENT, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated ceramic electronic component by which decrease in mechanical strength or occurrence of structural defects such as cracks in the laminated ceramic electronic component can be prevented inexpensively, even when a sintered body is reoxidized by annealing treatment, and to provide the laminated ceramic electronic component. SOLUTION: The method for manufacturing the laminated ceramic electronic part has a step wherein a green sheet and an internal electrode layer are laminated for obtaining a green chip, a step wherein the green chip is baked under reducing atmosphere for obtaining the sintered body, and a reoxidation step wherein the sintered body is annealed in a specified annealing atmosphere gas. In this case, the dew point of the annealing atmosphere gas in the reoxidation step is -50 to 0[°C] and the temperature of the annealing atmosphere gas in the reoxidation step is 900 to 1,100[°C]. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266289(A) 申请公布日期 2007.10.11
申请号 JP20060089083 申请日期 2006.03.28
申请人 TDK CORP 发明人 FUJIMURA TOMOYOSHI;SATO AKIRA
分类号 H01G13/00;H01G4/12;H01G4/30 主分类号 H01G13/00
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