发明名称 FUSE CUTTING METHOD AND FUSE EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To make it possible to cut a desired fuse securely and very simply without causing the increase of process despite the sufficiently thick formation of a protecting film covering a fuse. SOLUTION: First, a first laser light of short pulse width adjusted to be a short wave length suited to the absorption to a protection film 24 is irradiated to the portion corresponding to a fuse 22 of the protection film 2, a first aperture 24a of the radius R1 is formed in the protection film 24 so that the film thickness is optimum for cutting the fuse 22. Subsequently, to the inside of the aperture 24a, the laser light of long pulse width adjusted to be a long wave length suited to the absorption to the fuse 22 is irradiated to cut the fuse 22. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266304(A) 申请公布日期 2007.10.11
申请号 JP20060089310 申请日期 2006.03.28
申请人 FUJITSU LTD 发明人 ITAKURA TORU
分类号 H01L21/82 主分类号 H01L21/82
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