| 摘要 |
PROBLEM TO BE SOLVED: To prevent an adhesive from flowing into a cutout when bonding a plurality of plates forming a reservoir unit. SOLUTION: The reservoir unit is configured such that the five plates 11-15 are laminated. Two cutouts are provided at each of both ends in the short side direction of each of five plates 11-15 to form four cutouts 150a-150e on each plate. By laminating the five plates 11-15, the cutouts 150a-150e are superposed to form a through groove. A recessed section 151 is formed on the top face of the plate 13 along the cutout 150c to be adjacent thereto, the plate 13 bonded to the lower section of the plate 12 having the highest rigidity. An adhesive protruding from a portion between the cutout 150b and the cutout 150c when the plate 12 and the plate 13 are bonded to each other is reserved in the recessed section 151. COPYRIGHT: (C)2008,JPO&INPIT
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