| 发明名称 |
MULTIPLE FLIP-CHIP INTEGRATED CIRCUIT PACKAGE SYSTEM |
| 摘要 |
An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate.
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| 申请公布号 |
US2007235215(A1) |
申请公布日期 |
2007.10.11 |
| 申请号 |
US20060278070 |
申请日期 |
2006.03.30 |
| 申请人 |
STATS CHIPPAC LTD. |
发明人 |
BATHAN HENRY D.;CAMACHO ZIGMUND R.;TRASPORTO ARNEL;PUNZALAN JEFFREY D. |
| 分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
| 代理机构 |
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