AN APPARATUS FOR SPUTTERING SUBSTRATE

摘要

A sputtering apparatus which removes or minimizes deposition defects on the substrates and can perform the deposition process smoothly irrespective of change in the size of the substrates by uniformizing a sputtering region(i.e. by uniformizing sputtering time) to a plurality of substrates disposed on inner and outer sides of a substrate holder is provided. A sputtering apparatus comprises: an inner sputter supporting shaft supported from an inner side of a vacuum chamber and disposed within the vacuum chamber; at least one inner sputter part(200) including an inner sputter gun(220) which is disposed on an outer peripheral surface of the inner sputter supporting shaft, and has two inner target faces(221) such that targets(Ti) are disposed on the inner target faces, an inner sputter mounting part(230) of which one end extends from the outer peripheral surface of the inner sputter supporting shaft, and an inner sputter gun holder(240) of which one end is connected to an end of the inner sputter gun, and of which the other end is connected to the inner sputter mounting part, wherein extension lines of the inner target faces cross each other at a preset angle(theta) on a plane perpendicular to the length direction of the vacuum chamber; and at least one outer sputter part(300) including an outer sputter gun(310) on which an outer sputter face is formed, the outer sputter part being mounted on an inner wall surface of the vacuum chamber such that the outer sputter part faces the inside of the vacuum chamber.