| 摘要 |
PROBLEM TO BE SOLVED: To raise the connection reliability to a multilayer wiring board connected through interstitial via holes (IVH). SOLUTION: The multilayer wiring board (1) comprises a multilayer wiring layer having at least a first and second wiring layers (12), (32) laminated through an insulation layer, and connection vias (25) for electrically connecting the first and second wiring layers. The vias are composed of an inner conductor being aggregates of first metal grains (22) and a second metal film covering the entire inner conductor. COPYRIGHT: (C)2008,JPO&INPIT |
