| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly dense multilayer wiring board in which electric connectability is ensured between wiring layers in a conductor, and to provide a manufacturing method thereof. SOLUTION: In heating and pressurizing a laminate structure including an electric insulating base material and a wiring board via a press plate, the heating and pressurizing process includes a deviation generating process for generating a deviation between the laminate structure and the press plate before the temperature reaches a laminate deviation start temperature. Thus, distortion generated in a shearing direction of the electric insulating base material is suppressed, thereby suppressing the deformation of the conductor, and as a result, the multilayer wiring board excellent in electric connectability can be manufactured and provided. COPYRIGHT: (C)2008,JPO&INPIT |
