| 摘要 |
PROBLEM TO BE SOLVED: To provide a design support system and a program for proposing a new design method allowing reduction in a designing period and supporting designing following the design method even when a semiconductor package is designed using an already designed semiconductor chip. SOLUTION: For each of the case where an output of the semiconductor chip transits from "L" to "H" and the case where it transits from "H" to "L", a model showing the semiconductor chip by an internal impedance, a p/n MOS circuit, and a current source is generated, while analysis in a frequency area is carried out by using the model of the semiconductor chip. COPYRIGHT: (C)2008,JPO&INPIT |
