发明名称 |
Semiconductor device and method of producing the same |
摘要 |
A method of producing a semiconductor device includes the steps of forming a protrusion electrode on a semiconductor chip; and sealing the protrusion electrode and a semiconductor substrate with a resin layer. The method further includes the steps of polishing the resin layer until an upper surface of the protrusion electrode is exposed; polishing the exposed upper surface of the protrusion electrode; and forming a solder terminal on the polished upper surface of the protrusion electrode.
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申请公布号 |
US2007238289(A1) |
申请公布日期 |
2007.10.11 |
申请号 |
US20070652120 |
申请日期 |
2007.01.11 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
TANAKA YASUO |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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