发明名称 Semiconductor device and method of producing the same
摘要 A semiconductor device includes a semiconductor substrate having a first surface and a second surface opposite to the first surface; a first through wiring penetrating through the semiconductor substrate from the first surface to the second surface; an antenna formed on the first surface and electrically connected to the first through wiring; a semiconductor element formed on the second surface and electrically connected to the first through wiring; a first sealing layer formed on the second surface to cover the semiconductor element; and a first external terminal having one end portion exposed from the first sealing layer and the other end portion electrically connected to the semiconductor element.
申请公布号 US2007236393(A1) 申请公布日期 2007.10.11
申请号 US20060606224 申请日期 2006.11.30
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 ANZAI NORITAKA
分类号 H01Q1/38 主分类号 H01Q1/38
代理机构 代理人
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