发明名称 |
Semiconductor device and method of producing the same |
摘要 |
A semiconductor device includes a semiconductor substrate having a first surface and a second surface opposite to the first surface; a first through wiring penetrating through the semiconductor substrate from the first surface to the second surface; an antenna formed on the first surface and electrically connected to the first through wiring; a semiconductor element formed on the second surface and electrically connected to the first through wiring; a first sealing layer formed on the second surface to cover the semiconductor element; and a first external terminal having one end portion exposed from the first sealing layer and the other end portion electrically connected to the semiconductor element.
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申请公布号 |
US2007236393(A1) |
申请公布日期 |
2007.10.11 |
申请号 |
US20060606224 |
申请日期 |
2006.11.30 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
ANZAI NORITAKA |
分类号 |
H01Q1/38 |
主分类号 |
H01Q1/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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