发明名称 FORMING OF HTC DENDRITIC FILLERS
摘要 <p>In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.</p>
申请公布号 WO2007114874(A1) 申请公布日期 2007.10.11
申请号 WO2007US00087 申请日期 2007.01.03
申请人 SIEMENS POWER GENERATION, INC.;SMITH, JAMES D.B.;STEVENS, GARY;WOOD, JOHN W. 发明人 SMITH, JAMES D.B.;STEVENS, GARY;WOOD, JOHN W.
分类号 C08K3/00;C08K9/00 主分类号 C08K3/00
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