| 摘要 |
<p>An extremely thin wafer (wafer thickness is 10-200 µm) obtained by grinding the back of a semiconductor wafer is easy to break because it has low strength. It is also deformed easily and automation of subsequent process becomes difficult. As a means for solving that problem, a thin plate container which can secure the extremely thin wafer by vacuum suction is employed. The vacuum suction section of the container has a wafer suction surface for mounting a wafer, a plurality of suction holes for vacuum sucking the wafer opening onto the suction surface, a pressure reduction chamber connected with the suction holes, a suction opening connected with an external vacuum line, and a suction hole connecting the suction opening connected with an external vacuum line with the pressure reduction chamber and the suction opening. A supporting partition wall is provided in the pressure reduction chamber in order to support the suction plate. The suction plate has a structure separable from the container. A two-layer structure where the suction surface is composed of an elastic material and the other surface is composed of a polymer material having a fixed strength is employed. The wafer suction surface of the container is suitably concave for the peripheral portion. Since the waferis secured by vacuum suction, conveyance of the thin plate container and the process can be automated. The container can be used repeatedly with reduced environmental load.</p> |
