发明名称 LED MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface mounting LED module excellent in heat radiation characteristics of which the heat from an LED element is efficiently radiated to the outside. <P>SOLUTION: The LED module comprises an LED element 3, a stage 2 having a fitting surface at its upper part on which the LED element 3 is attached by flip chip mounting or face-up mounting, and a sealing member 6 of translucent resin or glass in which the LED element 3 is arranged on the stage 2, with the profile of the surface contacting the stage 2 being larger than that of the lower part of the stage 2. The heat from the LED element 3 is radiated from the side surface of the stage 2 made from ceramics or resin, and the heat from the LED element 3 is radiated from the outer surface of the sealing member 6 that seals the LED element 3. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266246(A) 申请公布日期 2007.10.11
申请号 JP20060088390 申请日期 2006.03.28
申请人 MITSUBISHI ELECTRIC CORP;MITSUBISHI ELECTRIC LIGHTING CORP 发明人 ISHII KENICHI;TANABE HIROYOSHI;OKAMOTO CHIEKO
分类号 H01L33/22;H01L33/54;H01L33/56;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/22
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