| 摘要 |
PROBLEM TO BE SOLVED: To provide a palladium-plating liquid for electrolysis, which imparts a plated film superior solder wettability, bonding strength to a wire or the like even though the plated film is thin, and to provide a lead frame showing the superior performances. SOLUTION: The palladium-plating liquid for electrolysis includes: a water-soluble palladium salt; and naphthalene monosulfonic acid or naphthalene disulfonic acid, which may have a substituent, or a salt of them. The lead frame is sequentially formed of an electrolytically plated palladium film formed by using the liquid, an electrolytically plated nickel film, the above electrolytically plated palladium film, and an electrolytically plated gold film. COPYRIGHT: (C)2008,JPO&INPIT |
