发明名称 CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a ceramic circuit board where the shrinkage of a green sheet laminate that becomes a ceramic laminate is extremely small and an electrode pattern that the ceramic laminate has is formed with high dimensional precision for a surface orthogonal to the lamination direction of the ceramic laminate, and to provide a manufacturing method of the ceramic circuit board. SOLUTION: In the ceramic circuit board, a ceramic sheet 10 has a first layer 11, and a second layer 12 laminated to the first layer 11. The first layer 11 is formed by a fired body of a ceramic green sheet. The second layer 12 is formed by a fired body of a glass paste film. The shrinkage start temperature of the ceramic green sheet that becomes the first layer 11 differs from that of the glass paste that becomes the second layer 12. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266028(A) 申请公布日期 2007.10.11
申请号 JP20060084916 申请日期 2006.03.27
申请人 SANYO ELECTRIC CO LTD 发明人 NOGUCHI HITOSHI
分类号 H05K3/46 主分类号 H05K3/46
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