METHOD OF REMOVING RESIDUES FROM SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of removing residues from a substrate. SOLUTION: A method of using a post-etch treatment system for removing photoresist remnants and etch residues formed during an etching process is described. For example, the etch residues may contain a material including halogens. The post-etch treatment system comprises a vacuum chamber, a radical generation system connected to the vacuum chamber, a radical gas distribution system that is connected to the radical generation system and configured to distribute reactive radicals above a substrate, and a high-temperature pedestal configured to be connected to the vacuum chamber and to support the substrate. The method comprises a step of introducing a NxOy-based process gas into the radical generation system. COPYRIGHT: (C)2008,JPO&INPIT