发明名称 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method capable of reducing remaining foreign matters on a substrate. SOLUTION: The substrate processing apparatus 1 is provided with a stage 4 for placing and rotating a substrate W, nozzles 6, 7 for supplying a processing liquid onto the rotating substrate W, and an air flow generating means for generating an air flow A from the upper part toward the substrate W. In this apparatus 1, an opening 4c is provided on a circumferential portion of the stage 4, so that the air flow A is allowed to pass through the lower part of the stage 4 via the opening 4c. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266371(A) 申请公布日期 2007.10.11
申请号 JP20060090370 申请日期 2006.03.29
申请人 EPSON IMAGING DEVICES CORP 发明人 WASHIMI DAISUKE;ARIMA HITOMI;SHIIDA NOBORU
分类号 H01L21/304;H01L21/027 主分类号 H01L21/304
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