METHOD OF FABRICATING AN INTERCONNECTION FOR ELECTRICALLY CONNECTING AN ELECTRICAL COMPONENT TO A SUBSTRATE

摘要

A method for fabricating an interconnection for electrically connecting an electrical component to a substrate, said method comprising the steps of providing a first substrate and forming thereon at least one first solder bump; providing a second substrate and forming thereon at least one second solder bump; positioning said at least one first and second solder bump to be in positional and angular alignment relative to one another, whereby the at least one first and second solder bumps are separated from one another by a first distance and the substrates are separated from one another by a second distance; heating the first and second solder bump till they are molten; reducing the first distance till the molten solder bumps merge into at least one single solder bump; maintaining the. at least one single solder bump in its molten state while increasing the second distance between the two substrates thereby lengthening said at least one single solder bump forming an at least one elongated solder bump; terminating the step of increasing the second distance between the substrates when the at least one elongated solder bump achieves a desired aspect ratio; reducing the temperature of the at least one elongated solder bump to its hot working temperature and maintaining it at said hot working temperature; carrying out a first offset of the first or second substrate in a direction substantially parallel to the plane of the corresponding substrate on which the at least one bump is formed; carrying out a second offset of the first or second substrate in a direction substantially perpendicular to the direction substantially parallel to the plane of the corresponding substrate on which the at least one bump is formed thereby decreasing the second distance separating the first and second substrates; lowering the temperature of the hot worked at least one elongated solder bump; and separating the hot worked at least one elongated solder bump from the first or second substrate.