<p>A memory card (10) is formed in the shape of a rectangular thin plate by a housing (12) and a rectangular multi-chip package (14). The housing is made of an insulating material and has a receiving recess (16) formed in the upper surface that is one of the surfaces in the thickness direction of the housing. The multi-chip package (14) is received in the receiving recess (16). The housing (12) has a rectangular bottom wall (20) and side walls (22) upstanding from three of the four sides of the bottom wall (20). Two sidewalls (22A) of the sidewalls (22) face each other, and the remaining one side wall (22B) connects one end of each of the two side walls (22A) together. A finger hold recess (40) is formed in a portion of a lower surface (1202) that is the other surface in the thickness direction of the housing (12), and the portion is located at a place corresponding to that side of the four sides of the bottom wall (20) where the side wall (22) is not provided.</p>
