摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment capable of improving the packaging density of electronic components in a shield case on a circuit board. SOLUTION: In the electronic equipment 20 having the circuit board 24 for packaging electronic components and the shield case 22 mounted on the circuit board, the shield case has a frame member 26 mounted to the circuit board while surrounding the electronic components, and a lid body 28 mounted to the frame member so that the frame member is covered. The frame member has a wall 30 arranged nearly vertical to the circuit board, and a bridge 34 arranged across an opening formed by the wall. The bridge has planes 40, 43 nearly in parallel with the opening surface of the wall, and vertical sections 38, 42, 44 nearly vertical to the opening surface of the wall. COPYRIGHT: (C)2008,JPO&INPIT
|