| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet with which generation of air bubbles between the sheet and a carrier plate is inhibited and an attitude of an electronic component is stabilized, and to provide a method for manufacturing the adhesive sheet, and a fixture for wiring board. <P>SOLUTION: The fixture for wiring board is constituted by comprising a heat-resistant base material layer 2; a weak adhesive layer 3 which is laminated on the surface of the base material layer 2 for detachably and adhesively holding a flexible wiring plate; a cured bonding layer 6 laminated on a rear surface of the base material layer 2; and peeling layers 8 which are peelably laminated on these weak adhesive layer 3 and the bonding layer 6, and fixing the bonding layer 6 to the surface of the carrier plate having rigidity by heat-bonding. Since the cured bonding layer 6 exhibits a strong bonding force by which peeling is impossible not a peelable adhesive force, even when the surface of the carrier plate is irregular or has moisture-absorption characteristics, large and small air bubbles are not generated between the adhesive sheet and the carrier plate when introducing into a solder reflow device. <P>COPYRIGHT: (C)2008,JPO&INPIT |
