发明名称 |
PRODUCTION METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of producing a semiconductor device and a display device using a peeling process, by which a transpose process can be performed in a satisfactory state maintaining the shape and characteristics of the device before the peeling and thereby to provide a technology capable of producing the semiconductor and display devices having higher reliability with high yield without complicating the devices and the processes. SOLUTION: This production method comprises: disposing an organic compound layer containing a photocatalyst substance on a first substrate having light transmitting properties; disposing an element layer on the organic compound layer containing a photocatalyst substance; irradiating a light to the organic compound layer containing a photocatalyst substance by passing the light through the first substrate; and peeling the element layer from the first substrate. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2007266593(A) |
申请公布日期 |
2007.10.11 |
申请号 |
JP20070047097 |
申请日期 |
2007.02.27 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
JINBO YASUHIRO;MORISUE MASAFUMI;KIMURA HAJIME;YAMAZAKI SHUNPEI |
分类号 |
H01L21/02;G02F1/1345;G02F1/136;G02F1/1368;H01L21/336;H01L27/12;H01L29/786;H01L51/50;H05B33/10;H05B33/14 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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