发明名称 MANUFACTURING METHOD OF BONDED SUBSTRATE AND MANUFACTURING METHOD OF ELECTRO-OPTICAL DEVICE
摘要 PROBLEM TO BE SOLVED: To enable to bond a first substrate and a second substrate with an adhesive without leaving any air bubbles inside. SOLUTION: Adhesives 6 are coated on four sheets of the first substrate 2 in a coating pattern 60 including a slanted line pattern, a first linear pattern 61 and a second linear pattern 62, after which, the second substrate 3 is made slanted from one side end part 201 of the first substrate 2 toward the other side end part 202 on the surface of the first substrate, and the fist substrate 2 and the second substrate 3 are bonded together with the adhesive 6. With this, no bubbles remain between the first substrate 2 and the second substrate 3. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007265625(A) 申请公布日期 2007.10.11
申请号 JP20060084935 申请日期 2006.03.27
申请人 SEIKO EPSON CORP 发明人 HIRAIDE KATSUJI
分类号 H05B33/10;H01L51/50 主分类号 H05B33/10
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