发明名称 DIE FOR FORMING HONEYCOMB STRUCTURE AND METHOD OF MANUFACTURING THE SAME
摘要 <p>A die (1) for forming a honeycomb structure has a die substrate (22) having a first plate-like member (23) and a second plate-like member (24). Grooves (7) are formed in that surface (28) of the first plate-like member (23) to which the second plate-like member (24) is joined. The depth y (mm) of the groove (7) satisfies the following expression (1): y = a.(t1 x El + t2 x E2)/(t1 x t2 x El x E2) ... (1) (where t1 is the thickness (mm) obtained by deducting the depth (mm) of the groove from the thickness (mm) of the first plate-like member, El is the apparent modulus (GPa) of volume elasticity at 25°C of the first plate-like member obtained considering that back holes are formed therein, t2 is the thickness (mm) of the second plate-like member, E2 is the modulus (GPa) of volume elasticity at 25°C of the second plate-like member, and a is a coefficient determined by conditions in manufacturing of the die.)</p>
申请公布号 WO2007114089(A1) 申请公布日期 2007.10.11
申请号 WO2007JP56147 申请日期 2007.03.26
申请人 NGK INSULATORS, LTD.;TAKAHASHI, HIRONORI;HIRONAGA, MASAYUKI 发明人 TAKAHASHI, HIRONORI;HIRONAGA, MASAYUKI
分类号 B28B3/26 主分类号 B28B3/26
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