| 摘要 |
<P>PROBLEM TO BE SOLVED: To control curvature of a ceramic substrate without adverse effects due to the heatsink curvature, at forming of molded resin, in an electronic device consisting of a substrate and electronic components sealed by using the mold resin, when the ceramic substrate equipped with electronic components is mounted on the heat sink. <P>SOLUTION: In the portions of one surface 11 of a heat sink 10 where a ceramic substrate 20 is mounted, projections 13, formed of a part of the portions which are made to project, are provided so as to support the ceramic substrate 20 on the projections 13. The portions, excluding the projections 13 in between the ceramic substrate 20 and the heat sink 10, are filled with mold resin 40. <P>COPYRIGHT: (C)2008,JPO&INPIT |
