| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a stainless transfer base, having a plated circuit layer capable of mainly improving the adhesiveness with respect to an insulating resin base in a plated circuit layer. <P>SOLUTION: In the stainless transfer substrate base 4 having a plated circuit layer, a plated circuit layer 3 is formed by plating the surface of a stainless base 1 with metal particles 2 as nucli. The plated circuit layer 3 is constituted of a plurality of plated layers 5, comprising one type or a plurality of types of plating species. The plating circuit layer 3 has a structure where the plated layer 5, farther from the stainless base 1, becomes wider than that near the stainless base 1 in adjacent plated layers 5. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
